thick film chip resistors design and speci? cations are each subject to change without notice. ask factory for the current technical speci? cations before purchase and/or use. should a safety concern arise regarding this product, please be sure to contact us immediately. e 1 r 2 j 3 3 4 g 5 e 6 y 7 j 8 1 9 0 10 2 11 v 12 thick film chip resistors product code size, power rating xge : 01005 1ge : 0201 2ge : 0402 3ge : 0603 6ge : 0805 8ge : 1206 14 : 1210 12 : 1812 12z : 2010 1t : 2512 0.031 w 0.05 w 0.063 w 0.1 w 0.125 w 0.25 w 0.25 w 0.5 w 0.5 w 1w power r. marking code y ? nil marking value marking on black side no marking resistance tolerance code j 0 tolerance 5% jumper the first two digits are significant figures of resistance and the third one denotes number of zeros following. decimal point is expressed by r as 4.7 = 4r7. jumper is expressed by r00. resistance value packaging methods code y c x v u packaging pressed carrier taping 2m m pitch, 20000 pcs. (only xge type) pressed carrier taping 2m m pitch, 15000 pcs. (only 1ge type) punched carrier taping 2m m pitch, 10000 pcs. (only 2ge type) punched carrier taping (only 3ge, 6ge, 8ge type) embossed carriertaping (only 14, 12, 12z, 1t type) type : inches thick film chip resistors 01005, 0201, 04 02, 0603 , 0805, 1206, 1210, 18 12, 2010 , 2512 type: erj xg, 1g, 2g, 3g, 6g, 8g, 14, 12 , 12z, 1t features small size and lightweight high reliability metal glaze thick ? lm resistive element and three layers of electrodes compatible with placement machines taping packaging available suitable for both re? ow and ? ow sol der ing reference standards iec 60115-8, jis c 5201-8, eiaj rc-2134b explanation of part numbers erjxge, 1ge, 2g e, 3ge, 6ge, 8ge, 14, 12, 12z, 1t series, 5 % type ? when omitted, the rest of the p/ n factors shall be moved up respectively. (only xge, 1ge, 2ge type) feb. 2006
design and speci? cations are each subject to change without notice. ask factory for the current technical speci? cations before purchase and/or use. should a safety concern arise regarding this product, please be sure to contact us immediately. thick film chip resistors protective coating alumina substrate electrode (inner) electrode (between) thick film r esistive element electrode (outer) ?0 20 0 20 40 60 80 100 120 140 160 0 180 ?0 155 c 70 c ambient temperature ( c) 20 40 60 80 100 rated load (%) ?5 c 3g, 6g, 8g xg, 1g,2g,14,12,12z,1t 125 c a b t w l construction dimensions in mm (not to scale) type (inches) dimensio ns (mm) mass (w eight) (g/1 000 pcs.) lwa b t erjxg (01005) 0.40 ?.02 0.20 ?.02 0.10 ?.03 0.10 ?.03 0.13 ?.02 0.04 erj1g (0201) 0.60 ?.03 0.30 ?.03 0.10 ?.05 0.15 ?.05 0.23 ?.03 0.15 erj2g (0402) 1.00 ?.05 0.50 ?.05 0.20 ?.10 0.25 ?.05 0.35 ?.05 0.8 erj3g (0603) 1.60 ?.15 0.80 +0.15 0.30 ?.20 0.30 ?.15 0.45 ?.10 2 erj6g (0805) 2.00 ?.20 1.25 ?.10 0.40 ?.20 0.40 ?.20 0.60 ?.10 4 erj8g (1206) 3.20 +0.05 1.60 +0.05 0.50 ?.20 0.50 ?.20 0.60 ?.10 10 erj14 (1210) 3.20 ?.20 2.50 ?.20 0.50 ?.20 0.50 ?.20 0.60 ?.10 16 erj12 (1812) 4.50 ?.20 3.20 ?.20 0.50 ?.20 0.50 ?.20 0.60 ?.10 27 erj12z (2010) 5.00 ?.20 2.50 ?.20 0.60 ?.20 0.60 ?.20 0.60 ?.10 27 erj1t (2512) 6.40 ?.20 3.20 ?.20 0.65 ?.20 0.60 ?.20 0.60 ?.10 45 ?.05 ?.15 ?.20 type (inches) power rating at 70 ? (w) limiting element voltage (maximum rcwv) (1) (v) maximum ov erload voltage (2) (v) resistance tolerance (%) resistance range ( ) t.c.r. [ 10 ? / c (ppm/ c)] category temperature range (o perating temperature range) (?) erjxg (01005) 0.031 15 30 5 10 to 1 m (e24) <100 : 300 100 <: 200 ?5 to +125 erj1g (0201) 0.05 15 30 5 1 to 10 m (e24) <10 : ?00 to +600 10 to 1 m : ?00 1 m <: ?00 to +150 ?5 to +125 erj2g (0402) 0.063 50 100 5 1 to 10 m (e24) 55 to +125 erj3g (0603) 0.1 50 100 5 1 to 10 m (e24) 55 to +155 erj6g (0805) 0.125 150 200 5 1 to 10 m (e24) 55 to +155 erj8g (1206) 0.25 200 400 5 1 to 10 m (e24) 55 to +155 erj14 (1210) 0.25 200 400 5 1 to 10 m (e24) 55 to +125 erj12 (1812) 0.5 200 400 5 1 to 10 m (e24) 55 to +125 erj12z (2010) 0.5 200 400 5 1 to 10 m (e24) 55 to +125 erj1t (2512) 1200400 51 to 1 m (e24) 55 to +125 type (inches) rated cu rrent (a) maximum over load current (a) erj1g (0201) 0.5 1 erj2g (0402) 12 erj3g (0603) erj6g (0805) 24 erj8g (1206) erj14 (1210) erj12 (1812) erj12z (2010) erj1t (2512) power derati ng curve for resistors operated in ambient temperatures above 70 c, power rating shall be derated in accordance with the gure below. (1) rate d continuous working voltage (rcwv) shall be de ter mined from rcwv= power rating re sis tance values , or limiting element voltage (max. rcwv ) list ed above, wh icheve r less. (2) overload (short-tim e overload) test voltage (sotv) shall be de ter mined from sotv=2.5 power rating or max. over load volt age list ed above which ev er less. ratings feb. 2006
thick film chip resistors design and speci? cations are each subject to change without notice. ask factory for the current technical speci? cations before purchase and/or use. should a safety concern arise regarding this product, please be sure to contact us immediately. f b w t f a f c tt t a p 0 p 2 p 1 p 1 f d 0 f d 1 (only emboss) b f w e (2 mm pitch) taping reel packaging methods (taping) standard quantity carrier tape type kind of taping pitch (p 1 )quantity erjxg pressed carrier taping 2 mm 2 0000 pcs./reel erj1g 15 000 pcs./reel erj2g punched carr ier taping 1 0000 pcs./reel erj3g 4 mm 5 000 pcs./reel erj6g erj8g erj14 embossed carrier taping erj12 erj12z erj1t 4 000 pcs./reel (unit : mm) type f a f b f c wt erjxg 18 0.0 +0 60 min. 13.0 ?.0 9.0 ?.0 11.4 ?.0 erj1g erj2g erj3g erj6g erj8g erj14 erj12 13.0 ?.0 15.4 ?.0 erj12z erj1t (unit : mm) ?.0 type a b w f e p 1 p 2 p 0 f d 0 t f d 1 erjxg 0.24 0.03 0.45 ?.03 8.00 ?.20 3.50 0.05 1.75 ?.10 2.00 ?.10 2.00 ?.05 4.00 ?.10 1.50 +0.10 0.31 0.05 erj1g 0.38 0.05 0.68 0.05 0.42 0.05 erj2g 0.67 0.05 1.17 ?.05 0.52 ?.05 erj3g 1.10 ?.10 1.90 ?.10 4.00 ?.10 0.70 0.05 erj6g 1.65 ?.15 2.50 ?.20 0.84 0.05 erj8g 2.00 ?.15 3.60 ?.20 erj14 2.80 ?.20 3.50 ?.20 8.00 ?.30 1.00 ?.10 1.0 +0.10 erj12 3.50 ?.20 4.80 ?.20 12.00 ?.30 5.50 ?.20 1.5 min. erj12z 2.80 ?.20 5.30 ?.20 erj1t 3.60 ?.20 6.90 ?.20 ?0 ?0 pressed carrier punched carrier embossed carrier feb. 2006
design and speci? cations are each subject to change without notice. ask factory for the current technical speci? cations before purchase and/or use. should a safety concern arise regarding this product, please be sure to contact us immediately. thick film chip resistors chip resistor c a b preheating peak heating temperature time type (inches) dimensio ns (mm) abc erjxg (01005) 0.15 to 0.20 0.5 to 0.7 0.20 to 0.25 erj1g (0201) 0.3 to 0.4 0.8 to 0.9 0.25 to 0.35 erj2g (0402) 0.5 to 0.6 1.4 to 1.6 0.4 to 0.6 erj3g (0603) 0.7 to 0.9 2 to 2.2 0.8 to 1 erj6g (0805) 1 to 1.4 3.2 to 3.8 0.9 to 1.4 erj8g (1206) 2 to 2.4 4.4 to 5 1.2 to 1.8 erj14(1210) 2 to 2.4 4.4 to 5 1.8 to 2.8 erj12(1812) 3.3 to 3.7 5.7 to 6.5 2.3 to 3.5 erj12z(2010) 3.6 to 4 6.2 to 7 1.8 to 2.8 erj1t(2512) 5 to 5.4 7.6 to 8.6 2.3 to 3.5 temp erature time preheating 140 c to 160 c 60 s to 120 s main heating above 20 0 c 30 s to 40 s peak 235 5 c max. 10 s temp erature time preheating 150 c to 180 c 60 s to 120 s main heat ing above 230 c 30 s to 40 s peak max. 260 ? max. 10 s for soldering f or lead-fre e soldering temp erature time temperature time preheating 140 c to 180 c 60 s to 120 s 150 c to 180 c 60 s to 120 s soldering 245 ?5 c 20 s to 30 s max. 260 c max. 10 s recommended land pattern in case of ow soldering, the land width must be smaller than the chip resistor width to control the sol der amount properly. generally, the land width should be 0.7 to 0.8 times (w) of the width of chip resistor. in case of re ow soldering, solder amount can be adju sted, therefore the land width should be set to 1.0 to 1.3 times chip resistor width (w). recommended soldering conditions recommendations and precautions are described below. recommended so ldering conditions for re ow for soldering (example : sn/pb) for lead-free soldering (example : sn/ag/cu) recommended soldering conditions for ? ow ?re ow soldering shall be performed a maximum of two times. ?please contact us for additional information when used in conditions other than those speci ed. ?please meas ure the temperature of the terminals and study every kind of solder and printed circuit board for solderability be fore ac tu al use. safety precautions the following ar e precautions for individual products. please also refer to the precautions common to fixed resistors shown on page er3 of this catalog. 1. take measures against mechanic al stress during and after mounting of thick film chip resistors (here af ter call ed the resistors) so as not to damage their electrodes and protective coatings. 2. if a transien t load (heavy load in a short time) like a pulse is expe cted to be applied, check and evaluate the operations of the resistors when installed in your products before use. never exceed the rated power. otherwise, the performance and/ or reliab ility of the resistors may be impaired. 3. do not us e halogen-based or other high-activity ux. otherwise, the residue may impair the resistors' per for mance and/or re liability. 4. when soldering wi th a soldering iron, never touch the resistors' bodie s with the tip of the soldering iron. when using a soldering iron with a high temperature tip, nish soldering as quickly as possible (within three seconds at 350 c max.). 5. as the amount of applied solder becomes larger, the me chanical stress applied to the resistors increases, causing problems such as cracks and faulty characteristics. avoid applying an excessive amount of solder. 6. do not appl y shock to the resistors or pinch them with a hard tool (e.g. pliers and tweezers). oth er wise, the re sis tors' protective coatings and bodies may be chipped, affecting their performance. 7. avo id exc e s s i ve b e n d ing of printed circuit boards in order to protect the resistors from abnormal stress. feb. 2006
? er3 ? safety precautions (common precautions for fixed resistors) when using ou r products, no matter what sort of equipment they might be used for, be sure to make a written agreement on the speci? cations with us in advance. the design and speci? cations in this catalog are subject to change without prior notice. do not use the products beyond the speci? cations described in this catalog. this cata log explains the quality and performance of the products as individual components. be fore use, check and evaluate their operations when installed in your products. install the following systems for a failsafe design to ensure safety if these products are to be used in equip ment where a defect in these products may cause th e loss of human life or other signi? cant damage, such as damage to vehicles (au to mo bile, train, vessel), traf? c lights, medical equipment, aerospace equipment, elec tric heating ap pli anc es, com bus tion/gas equipment, rotating equipment, and disaster/crime prevention equip ment. ? systems equipped with a protection circuit and a protection device ? systems equip ped with a redundant circuit or other system to prevent an unsafe status in the event of a single fault (1) precauti ons fo r use these products are designed and manufactured for general and stan dard use in general elec tron ic equipment (e.g. av equipm ent, home el ectric ap pli anc es, of? ce equipment, information and com mu ni ca tion equipment) these products are not intended for use in the following special conditions. be fore u sing the products, care ful ly check the effects on their quality and performance, and determine whether or not they can be used. 1. in liquid, such as water, oil, chemicals, or organic solvent 2. in direct sunlight, outdoors, or in dust 3. in salty air or air with a high concentration of corrosive gas, such as cl 2 , h 2 s, nh 3 , so 2 , or no 2 4. electric static discharge (esd) environment these components are sensitive to static electricity and can be damaged under static shock (esd). please take measures to avoid any of these environments. smaller componen ts are more sensitive to esd environment. 5. electromagnetic environment avoid any enviro nment where stro ng electromagnetic waves exist. 6. in an environment where these pr oducts cause dew condensation 7. s e a li n g o r c o ating of these products or a printed circuit board on which thes e products are mounted, with resin or othe r materials these products generate joule heat when energized. carefu lly position th ese products so that their heat will not affect th e other components. carefully position thes e products so that their temperatures will not exceed the category temperature range due to the effect s of neighboring heat-generating com po nents. do not mount or place heat-generating com po nents or in? ammables, such as vinyl-coated wires, near these products . note that non- cleaning solder, halogen-based highly active ? ux, or water-soluble ? ux may dete riorate the performance or reliab ility of the products. carefully select a ? ux cleaning agent fo r use after soldering. an unsuit able agent may deteriorate the performance or reliability. in particular, when using water or a water-soluble cleaning agent, be careful not to leave water res i dues. otherwise, the insulation performance may be deteriorated. (2) precaution s for storage the performance of these products, including the solderability, is guaran teed fo r a year from the date of arrival at your company, provided that they remain packed as they were when delivered and stored at a temperature of 5 c to 35 c and a relative humidity of 45 % to 85 %. even wi thin the above guarantee periods, do not store these products in the fol low ing conditions. otherwise, their elec tri cal performance and/or solderability may be dete riorated, and the packaging materials (e.g. tap ing ma te ri als) may be de formed or dete riorated, resulting in mounting failures. 1. in salty air or in air with a high concentration of corrosive gas, such as cl 2 , h 2 s, nh 3 , so 2 , or no 2 2. in direct sunlight package ma rkings include the product number, quantity, and country of origin. in principle, the country of origin should be indicated in english. feb. 2006
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